Heat-Resistant Improvement in the Electroless Ni-P/Au Plating Film
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چکیده
منابع مشابه
Mechanisms and solutions to the brittle solder joint in electroless Ni plating
Brittle solder joints in Electroless Ni electroless Pd immersion Au (ENEPIG) surface finishes are one of the key re liability issues in electronics assembly. Previous characterization of the reflow process has indicated that interfa cial voids formed after solder reflow are responsible for the decreases in solder joint strength. However, the mechanisms behind the formation of these voids in t...
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ژورنال
عنوان ژورنال: Journal of The Surface Finishing Society of Japan
سال: 2015
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.66.450